Thermal Gap Pads
TIF700 Silicone Gap Pad 7.0 W/mK
TIF700
High-compression soft pad for uneven interfaces, 0.5–5 mm.
技術參數
| 1 | |||
|---|---|---|---|
| 2 | 3 | ||
| 4 | |||
| 5 | 6 | ||
產品概述
TIF700 delivers stable interface contact at 10–30 psi assembly pressure, well suited to power modules with generous tolerances.